WEEK 4 (FYP 2)

Title : Research on component used

Continuing from last week, I did another research on another components that will be used in the project.

Heatsink :

Heat sink is a thermal conductive metal device constructed to absorb and transfer heat away from a high temperature object such as a computer processor. Normally heat sinks are attached with built-in fans to help keep both the CPU and the heat sinks at a proper temperature. Heat sinks made are made out of metal such as copper or aluminium alloy and attached to the processor. Lot of heat sinks have fins and thin slices of metal joined with the base of the heat sink which helps to spread the heat over a substantial area.

Heat sink can be classified into two categories which is active heat sink and passive heat sink. Active heat sink is where the combination of heat sink and a fan which is also known as heat sink and fan (HSF) while passive heat sink are those that have no mechanical components. In addition, thermal compound or thermal grease is sometimes used as a coating between the device and heat sink to enhance the thermal conduction.